Nostra uber est innovative altus-density flexibile electronic fabrica disposito specie ad industria repono applications. Utrobsing Advanced Techniques et Materials, nostri circuitu tabula features a praecisione duplex, postesided II-layer flexibilia structuram, enabling efficiens altilium administratione. In vestri vestibulum processus, weve optavit pro uno postesque tenaces advolvit aeris ffoyle ut subiectum, cum cubits of I mil / I oz / XX um. In operimentum amet est de polyimide, cum cubits of XXV um ad quod XLV um pi. Praeterea, nickel plating cum duritia range of HV140 ~ CLXXI est incorporatus. Praeterea auxilia materiae ut acrylic tutela amet, una-layer Silicone tutela amet, et transparent pet thermoformem et vasa sunt, et usus.
In our production process, our product undergoes key processes including material preparation, pre-treatment, dry film lamination, exposure/development, etching/deburring, AOI inspection, punching, copper-via-lamination, pressing, curing, testing, OSP treatment, cutting, punching, final quality check, and final quality assurance. Notabiliter processibus ut etching / deburring, aoi inspectionem, Punching, urgeat, curantes, et temptationis habent significant impingit in productum qualis et perficientur.
Nostra uber est meticulously disposito, utitur processibus processibus, et gloriatur altum efficientiam, densitas et reliability. Per exquisita technology et restrictior qualitas imperium, ut quisque circuitu tabula obsequitur cum Rohs et pervenire SVHC signa, tum mos-specifica requisita. Nostri aim est providere customers cum una-subsisto customized servicia in occursum eorum industria repono necessitates, ita offerens robust firmamentum pro eorum uber perficientur et reliability.
