Follow

close

Choose Your Site

Global

Social Media

SMT & Assembly

Home » Capabilities » SMT & Assembly

SMT & Assembly

SMT Process

HECTECH is equipped with 15 large SMT process lines, 10 dispensing lines, and ICT testing with long size SMT capability to undertake full process processing of new energy, automotive electronics, industrial control and medical products.
ICT/ET Test

SMT workshop is equipped with automatic solder paste printing machine, dispensing machine, plasma cleaning machine, high-speed placement machine, AOI, oven, first piece inspection and other necessary processes.DIP workshop is equipped with wave soldering production line, ICT/ET test production.

Assembly Workshop

We offer anti-static bag packaging, foam protection packaging, carton packaging, vacuum packaging, custom packaging, and more for your convenience.

Reinforcement

Through the reinforcement assembly process, we add reinforcement materials or layers, including PI, steel sheet, adhesive paper, and pet, to specific areas of the film substrate to improve its mechanical properties and durability.
Press

We use the press process to fasten flexible circuit boards to other assemblies or components. Through hot pressing, press transfer, and quick pressing, we ensure that the flexible circuit boards are firmly bonded to other materials, thus ensuring a solid and reliable connection.
Packaging

We offer anti-static bag packaging, foam protection packaging, carton packaging, vacuum packaging, custom packaging, and more for your convenience.

Sign up for our newsletter
get ready for the future
sign up for our newsletter to get updates straight to your inbox

Submit

Products
Capabilities
More Links
- Industries
- About
- Service
- News
- Contact
- Privacy Policy
Contact Us

Email: laniyah@hectechfpc.com

Tel: +86-1519639538
Social Networks