Automotive Electronic Highdensity Multilayer Flexible PCB

Facing the challenges of high-density multi-layered design, we have successfully achieved the goal of accommodating more functional modules and components in limited space by optimizing wiring planning and employing advanced stacking techniques. Simultaneously, we have overcome the difficulties of flexible printed circuit boards adapting to complex curved surfaces. We have developed materials with high flexibility and tensile strength, combined with advanced processing techniques, enabling them to bend freely in the interior space of automobiles while maintaining stable electrical performance. While ensuring the stability and reliability of the circuit boards, we have also addressed the challenges of harsh environmental conditions by selecting materials that are resistant to high temperatures and corrosion, and designing corresponding protective measures and rigorous testing procedures.