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High-Density Layout Design: Implement high-density layout design to minimize the size of the circuit board, thereby enhancing integration and performance efficiency.
High-Performance Material Selection: Choose high-performance flexible substrates and conductive materials, such as polyimide (PI) substrates and highly conductive copper foil, to meet the high-frequency and high-current operational requirements of the electric motor drive control system.
Multilayer Structure Design: Adopt a multilayer PCB design to increase the current-carrying capacity and signal transmission channels of the circuit board, enhancing the overall performance and reliability of the system.
Etched Circuit Technology: Utilize etched circuit technology to manufacture high-density circuit boards, ensuring the accuracy and stability of the circuits, thereby improving the efficiency and reliability of the circuit boards.
Organic Solderability Preservatives (OSP) Technology: Employ Organic Solderability Preservatives (OSP) technology to protect the copper foil surface of the circuit board, preventing oxidation and contamination during the manufacturing process, and improving soldering performance and reliability.
Copper Foil Surface Treatment: Chemically treat the copper foil surface during the circuit board manufacturing process to form an organic protective layer, enhancing its oxidation resistance and corrosion resistance while maintaining soldering performance and signal transmission quality.
Optimization of Soldering Performance: OSP technology can enhance the soldering performance of the circuit board, reducing oxidation during soldering and ensuring the reliability and stability of solder joints.
