Material Electio: Elige materiae cum bono scelerisque conductivity et summus temperatus stabilitatem, ut polyimide (Pi), ut stabilitatem et salus de circuitu tabula in altum temperatus environments.
Multilayer structuram Design: adopt a multilayer structuram consilio ad amplio calor dissipationem perficientur et efficientiam de circuitu tabula, dum augendae eius current-portantes facultatem et signo transitum canalis.
Thermal PROLIXUS aeris ffoyno, addere scelerisque PROCUTULUS aeris ffoyle layers intra circuitus tabula ad augendae calor dissipationem efficientiam vel clausura, maintaining temperatus stabilitatem in potentia altilium ratio.
High-Temperature Environment Testing: Dedux High-Temperature Environment Testing ad aestimandas stabilitatem et æstus dissipationem perficientur de circuitu tabula sub alte-temperatus conditionibus, cursus.
Diuturnitatem Testing: Flectere Flecte patientia temptationis et cortices vires temptationis ad assess ad diuturnitatem et structural stabilitatem de circuitu tabula, ensuring eam manet undamaged in flexione vel vibration.
Environmental Adaptability Testing: Conduct environmental adaptability testing such as salt spray testing, high-temperature and high-humidity testing, etc., to ensure the stability and reliability of the circuit board in various harsh environments.
