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This product is an FPC (Flexible Printed Circuit Board), using polyimide (PI) and FR4 as substrates, with a thickness range of 0.05mm to 0.75mm. Its dimensions are 200*300mm.
As an FPC manufacturer, our product features a multilayer design that can be customized according to the specific requirements of customers. The copper foil thickness ranges from 0.5 to 4 ounces, with a minimum hole diameter of 0.1mm, and minimum line width and spacing of ±0.02mm and ±0.05mm, respectively.
Surface treatment options include immersion gold or OSP, ensuring excellent solderability and reliability. Our FPC is suitable for various applications, including consumer electronics, medical devices, industrial control, and other fields.